Title:
HEIGHT SENSOR CONNECTING STRUCTURE
Document Type and Number:
Japanese Patent JP2004230920
Kind Code:
A
Abstract:
To easily connect a height sensor on a chassis frame side to an axle.
An inter leaf 9 fixed to a front axle 2 together with leaf springs 4 and 5 is used as a bracket in common, and a link rod 19 for operating the height sensor 23 attached to the chassis frame 1 is connected to the inter leaf 9.
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Inventors:
SAKUMA YUTAKA
Application Number:
JP2003018424A
Publication Date:
August 19, 2004
Filing Date:
January 28, 2003
Export Citation:
Assignee:
HINO MOTORS LTD
International Classes:
B60G11/10; B60G9/04; (IPC1-7): B60G11/10; B60G9/04
Attorney, Agent or Firm:
Tsunemitsu Yamada
Seiichi Otsuka
Seiichi Otsuka