Title:
高周波回路基板の製造方法、及び高周波回路基板
Document Type and Number:
Japanese Patent JP7231428
Kind Code:
B2
Abstract:
A method for producing a high frequency circuit board includes forming an antenna pattern on an upper surface of the provisional substrate. The method includes performing hot-press in a state where a thermoplastic resin and a provisional conductor are stacked on the upper surface of the provisional substrate, to form a first dielectric layer portion covering the antenna pattern. The method includes removing the provisional conductor and shaving the first dielectric layer portion to form a cavity to house an electronic component. The method includes mounting the electronic component on the antenna pattern in the cavity. The method includes performing hot-press in a state where a thermosetting resin and a ground conductor are stacked at an opening side of the cavity in the first dielectric layer portion, to form a second dielectric layer portion to embed the electronic component in the cavity. The method includes removing the provisional substrate.
Inventors:
Go Okucho
Akira Nakatsu
Kojiro Iwasa
Yusuke Natsuhara
Akira Nakatsu
Kojiro Iwasa
Yusuke Natsuhara
Application Number:
JP2019022801A
Publication Date:
March 01, 2023
Filing Date:
February 12, 2019
Export Citation:
Assignee:
Nippon Pillar Industry Co., Ltd.
International Classes:
H05K1/16; H05K1/02; H05K1/03; H05K3/00
Domestic Patent References:
| JP2012079994A | ||||
| JP2005223223A |
Foreign References:
| US20150016078 |
Attorney, Agent or Firm:
Patent Attorney Corporation Suncrest International Patent Office