Title:
HIGH-FREQUENCY CIRCUIT MODULE
Document Type and Number:
Japanese Patent JP2633421
Kind Code:
B2
Abstract:
PURPOSE: To improve heat-dissipating characteristics, and to ensure excellent connection with other high-frequency circuit modules in a high-frequency plane circuit module constituted by mounting a high-frequency plane circuit component and a heat-generating component onto a metallic base.
CONSTITUTION: A plurality of grooves 17 reaching to component mounting surface from a surface on the reverse side to the component mounting surface of a metallic base 16 are formed and constituted near the boundary sections of high-frequency plane circuit components 3 and a heat-generating component 4 on the metallic base 16.
Inventors:
YABE NORIO
Application Number:
JP22401491A
Publication Date:
July 23, 1997
Filing Date:
September 04, 1991
Export Citation:
Assignee:
FUJITSU KK
International Classes:
H01L23/12; H01L23/36; (IPC1-7): H01L23/36; H01L23/12
Domestic Patent References:
| JP2188948A |
Attorney, Agent or Firm:
Matsumoto