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Title:
HIGH FREQUENCY CIRCUIT PACKAGE
Document Type and Number:
Japanese Patent JPH05199019
Kind Code:
A
Abstract:

PURPOSE: To improve the performance of a high frequency circuit whose input output section employs a throughhole and to simplify the structure.

CONSTITUTION: A wall 12 parting a high frequency circuit formed to an upper side of a dielectric base 11 from an external part is provided to the base 11. A ground conductor 14 at the lower side of the base 11, a coplaner line conductor 15 of the lower side, a through hole 16 made to the base 11, in which conductors are packed to connect electrically a ground conductor 14 at the lower side of the base 11 and the microstrip line conductor 13 are provided to the base 11. The ground conductor 14 and the microstrip line conductor 13 form the microstrip line and the coplaner line conductor 15 and the ground conductor 14 form a coplaner waveguide line and both the lines have the same characteristic impedance.


Inventors:
OHASHI YOJI
SAITO TAMIO
KAWASAKI YOSHIHIRO
Application Number:
JP698892A
Publication Date:
August 06, 1993
Filing Date:
January 18, 1992
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
H01P3/08; H01P5/08; (IPC1-7): H01P3/08; H01P5/08
Attorney, Agent or Firm:
Aoki Akira (3 outside)



 
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