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Title:
HIGH FREQUENCY IC ELEMENT MOUNTING BODY AND EVALUATION METHOD FOR HIGH FREQUENCY IC ELEMENT
Document Type and Number:
Japanese Patent JPH08130270
Kind Code:
A
Abstract:

PURPOSE: To enhance the characteristics by reducing the inductance component when a high frequency IC element is mounted on a substrate.

CONSTITUTION: When a high frequency IC element 11 is mounted on a substrate 1, the end part of contact between a ground pin 12 of the high frequency IC element 11 and a ground pattern 2 of a gold film 7 is located at the position of a via hole 6 for making electrical connection with the earth on the rear surface or in the vicinity thereof (within 0.5mm).


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Inventors:
HIRAI TOSHIKAZU
HONDA KEIICHI
UDA NAONORI
NISHIDA MASAO
SAWAI TETSUO
HARADA YASOO
Application Number:
JP26774594A
Publication Date:
May 21, 1996
Filing Date:
October 31, 1994
Export Citation:
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Assignee:
SANYO ELECTRIC CO
International Classes:
H01L21/66; H01L23/02; H01L23/04; H01L23/12; G01R31/26; (IPC1-7): H01L23/04; G01R31/26; H01L21/66; H01L23/12
Attorney, Agent or Firm:
Tono Kono



 
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