Title:
HIGH-SPEED CUTTING DEVICE
Document Type and Number:
Japanese Patent JP2023013948
Kind Code:
A
Abstract:
To provide a high-speed cutting device.SOLUTION: A high-speed cutting device comprises a fitting frame, a material carrier mechanism, a straight line follow-up mechanism, a pole piece guide plate, and an acceleration driving mechanism. The acceleration driving mechanism is located on a material outlet side of the pole piece guide plate, and is so configured as to perform acceleration driving for a material band. By installing the acceleration driving mechanism in the rear of the straight line follow-up mechanism, acceleration driving for the material band is realized, and a delivery speed of the material band can reach a specified value. A speed and an acceleration of the straight line follow-up mechanism do not have to be large when performing straight line follow-up cutting, straight line follow-up cutting can be achieved at a relatively small, lamination piece manufacturing accuracy and efficiency can be improved, and mechanism stability can be improved.SELECTED DRAWING: Figure 1
Inventors:
LI PANPAN
PANG WENWU
CAO SHUNNAN
WU XUEKE
YANG RUKUN
PANG WENWU
CAO SHUNNAN
WU XUEKE
YANG RUKUN
Application Number:
JP2022077981A
Publication Date:
January 26, 2023
Filing Date:
May 11, 2022
Export Citation:
Assignee:
SHENZHEN GEESUN INTELLIGENT TECH CO LTD
International Classes:
B23D25/04; B23D15/00
Domestic Patent References:
| JP2009522105A | 2009-06-11 | |||
| JPS5382883U | 1978-07-08 | |||
| JP2008200788A | 2008-09-04 | |||
| JPS5871059A | 1983-04-27 | |||
| JP2006000951A | 2006-01-05 | |||
| JPS61176455A | 1986-08-08 | |||
| JP2016173884A | 2016-09-29 |
Attorney, Agent or Firm:
Shin Shin