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Patent Searching and Data


Title:
HIGH STRENGTH CONDUCTIVE RESIN MOLDED PRODUCT AND PREPARATION THEREOF
Document Type and Number:
Japanese Patent JPH01225541
Kind Code:
A
Abstract:

PURPOSE: To obtain a TLCP molded product having high conductivity, high heat resistance and high mechanical strength, by bonding a conductive inorg. substance to the surface of a molded product composed of specific liquid crystal polyallylate or polyesteramide having a mesogen group in the main chain thereof.

CONSTITUTION: A molded product is composed of TLCP (liquid crystal polyallylate or polyesteramide) having a mesogen group in the main chain thereof and a conductive inorg. substance is bonded to the surface of the molded product and TLCP has no exothermic peak based on melting at 200°C or more when the polymer is measured by a differential scanning calorimeter sealed by nitrogen. Herein, X and Y are a terminal group such as an alkyl group, an alkoxy group or a cyano group and A-B is a unit 2. As the conductive inorg. substance, tin oxide is especially pref. and the bonding amount thereof is at least 0.1wt.% or more and the film thickness thereof is 0.1μm or more.


Inventors:
UMEZAWA MASAO
KODERA YASUICHI
YAMAMOTO MASAHARU
Application Number:
JP5091988A
Publication Date:
September 08, 1989
Filing Date:
March 03, 1988
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
C08J7/06; B32B7/02; B32B9/00; C08G63/16; C08G63/18; C08G63/19; C08G63/60; C08G63/68; C08G69/46; C08G69/48; H01B1/20; (IPC1-7): B32B7/02; B32B9/00; C08G63/18; C08G63/60; C08G63/68; C08G69/46; C08J7/06; H01B1/20