PURPOSE: To obtain the high strength copper alloy for a lead frame having particularly excellent interface peeling resistance in soldering and retaining high conductivity by forming it with the compsn. contg. each prescribed amt. of Ni, Sn, Zn and P and the balance Cu with inevitable impurities.
CONSTITUTION: The high strength copper alloy for a lead frame is composed of the compsn. contg. 1.2 to 2.8% Ni, 1.0 to 5.0% Sn, 0.3 to 1.3% Zn, 0.03 to 0.3% P and the balance Cu with inevitable impurities. By the copper alloy, sufficient work hardening can be shown, so that strength equal to that of high Ni alloy can be retained as well as about 66% working ratio. Furthermore, interface peeling resistance in soldering can perfectly be prevented without influencing highly on the lowering of the dielectric constant by suitably adding Zn to the alloy. In this way, the alloy is suitable for working a lead frame into copper alloy.
HAGIWARA NOBORU
SASAKI HAJIME
| JPS61174344A | 1986-08-06 | |||
| JPS63293130A | 1988-11-30 | |||
| JPH01242742A | 1989-09-27 |
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