PURPOSE: To eliminate the necessity for mounting and replacing work of parts and complicated storage of replacement parts, by simultaneously moving a frame guide rail and positioning pin to correspond to a change of frame width in a frame feed mechanism for a wire bonding or die bonding device.

CONSTITUTION: If a width of a frame 65 is changed, a rail 57 is moved in the direction of an arrow head D. While a relative position between the rail 57 and a positioning pin 103 is not necessary to be changed because a distance from a side end of the frame 65 to a positioning pin hole 65a is in a fixed value. Further when replacement of the pin 103 is required, a positioning pin block 106 is not removed, but a removable positioning pin guide 105 is removed and the frame 65 is removed from the rail 57, if a width W of an opening part of the block 106 is formed larger than a diameter (d) of the pin 103, the pin 103 can be extended through the rail 57 and removed off upward, further can be reversely mounted.