PURPOSE: To effectively hold a circuit board rapidly at the time of switching its type by heating a real circuit board from its surface, holding it by a predetermined pressing force with a thermally flexible material from its rear face for a predetermined period of time, forming in advance a holding jig of the shape corresponding to the uneven parts of the rear face, and using it in a mounting step of a leadless electronic component.
CONSTITUTION: A circuit board 4 in which the mounting of its rear face is already completed is heated from its front face by a far infrared ray heat source 5, the board 4 is energized by means provided separately with a housing 7 filled with styrene foam 6 from below, melted by the heat of the board 4, and the surface of the styrol 6 is molded. The shape of a holding jig 8 of the board formed according to this method is similar to the uneven part of the component. Further, the jig 8 is mounted in a leadless electronic component mounting machine to become a jig for effectively holding the whole rear face of the board 4 at the time of mounting of the component. Thus, the board can be effectively held rapidly at the time of switching its type, the mounting accuracy of the component is obtained, and the yield of manufacturing the board is largely improved.
| JPH11103197 | ELECTRONIC PARTS SUCTION NOZZLE |
| JPS5458874 | DEVICE OF CORRECTING CAMBER OF PRINT WIRING SUBSTRATE |
| JPH06152116 | DEVICE FOR FIXING BOARD-MOUNTED PART |
SENO MASAYUKI
TAKAICHI SUSUMU
FUJIWARA MUNEYOSHI
TAKANO MASANORI
OKADA TAKESHI
| JPS54157274A | 1979-12-12 | |||
| JP63091334B | ||||
| JPS4727377A |