Title:
HOLE CHECK METHOD FOR PRINTED SUBSTRATE
Document Type and Number:
Japanese Patent JP2609808
Kind Code:
B2
Abstract:
PURPOSE: To check existence/absence of a reference hole bored accurately in relation to the center of a target mark.
CONSTITUTION: The cold line light of LED 6 installed in the boring tool guide hole 101 of a table 100 does not entirely affect by heat to a printed substrate 1 and detects the center of a target mark 11 accurately and a reference hole 21 is bored while matching the center of the hole to the center of the target mark. A cupper foil, which is the target mark 11, is a binarization and discriminated to black (negative) and the foundation of the printed substrate 1 is discriminated to white (positive) respectively. This black area is calculated by an image processing device before boring. The hole of the target mark 11 of the boring tool 5 is discriminated to white (positive) by the image by the pass of incident rays from LED 6. The black area of the target mark 11 remained in a ring shape is calculated after boring. It is judged respectively that the hole is bored when there is some difference between both black areas and the hole is not bored when there is no difference between both black areas.
Inventors:
Takashi Suzuki
Application Number:
JP6943594A
Publication Date:
May 14, 1997
Filing Date:
April 07, 1994
Export Citation:
Assignee:
UHT Co., Ltd.
International Classes:
B23Q17/24; B23B41/00; B23B49/00; B26F1/16; G01B11/28; G06T1/00; G06T7/00; H04N1/411; H05K3/00; (IPC1-7): B23Q17/24; B23B41/00; B23B49/00; B26F1/16; G01B11/28; G06T7/00; H04N1/411; H05K3/00
Domestic Patent References:
| JP534292A | ||||
| JP311597U | ||||
| JP6017937U |
Attorney, Agent or Firm:
Hayakawa Masaname