Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HONEYCOMB SANDWICH BOARD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH04173133
Kind Code:
A
Abstract:

PURPOSE: To improve the heat dissipation property and heat resistance as honeycomb sandwich board for cosmic apparatus and prevent thermal strain from developing at forming by a method wherein skin material made of carbon fiber reinforced carbon is arranged above and below aluminum honeycomb core so as to be integrally bonded together employing low melting alloy as adhesive.

CONSTITUTION: Under the condition that nickel plating is applied on the joint surface of skin materials 1a and 1b, each of which consists of continuous carbon fiber cloth 2 as base material and carbon 3 as matrix, of a honeycomb core 4 and of a heat pipe 6. The heat pipe 6 is embedded in the honeycomb core 4 so as to bring into contact with the skin material 1a. Further, soldering foil 5 is arranged between the joint surfaces of the respective upper and lower skin materials 1a and 1b and of the honeycomb core 4 so as to be laminated in sandwich constitution in order to fuse the soldering foil 5 under pressure of 1-2kg/cm2 and the temperature of 150-200°C, resulting in strongly joining the skin material 1a and 1b to the honeycomb core 4 and the skin material 1a and 1b to the heat pipe 6.


Inventors:
YANO ISAMU
ONO TOSHIO
MATSUBAYASHI MIWAKO
Application Number:
JP29913190A
Publication Date:
June 19, 1992
Filing Date:
November 05, 1990
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B23K1/00; B32B3/12; B32B7/02; H04B7/185; (IPC1-7): B23K1/00; B32B3/12; B32B7/02; H04B7/185
Attorney, Agent or Firm:
Kaneo Miyata (3 outside)