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Patent Searching and Data


Title:
HORIZONTAL SUBSTRATE TRANSFER MECHANISM
Document Type and Number:
Japanese Patent JPH0685043
Kind Code:
A
Abstract:

PURPOSE: To provide a mechanism for transferring horizontal wafers in an MBE system in such a manner that the wafer surface for epitaxial growth is protected from contamination.

CONSTITUTION: A semiconductor substrate 1 is held with its surface 1F facing downward above an opening 3 provided on a substrate holder 2, and the semiconductor substrate 1 is horizontally carried together with the substrate holder 2, a substrate transfer mechanism 4 thus configured. The delivery of the substrate holder 2 to and from the mechanism 4 is performed on the upper surface side of the substrate holder 2 where the rear side 1b of the semiconductor substrate 1 is exposed.


Inventors:
NANBU KAZUO
Application Number:
JP23252892A
Publication Date:
March 25, 1994
Filing Date:
September 01, 1992
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
B25J15/06; H01L21/203; H01L21/677; H01L21/68; H01L21/683; (IPC1-7): H01L21/68; B25J15/06
Attorney, Agent or Firm:
Teiichi