Title:
HOT MELT ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JPS5550078
Kind Code:
A
Abstract:
A method of filling a cavity in a substrate which comprises applying excess adhesive composition as a hot melt into the cavity, spreading the adhesive composition to fill the cavity, cooling the adhesive composition and sanding the composition to provide a surface even with the surrounding substrate. The adhesive composition comprises a block copolymer, a particulate mineral reinforcing agent and glass fiber. The block copolymer is selected from the group consisting of copolyesters, copolyamides, copoly(esteramides) and copoly(ether-esters) melting at a temperature above about 150 DEG C. and having from about 30 to about 70 weight percent of hard segments and from about 70 to about 30 weight percent of soft segments. The weight ratio of block copolymer to particulate mineral reinforcing agent and glass fiber is in the range of about 3:7 to about 3:2, the weight ratio of block copolymer to glass fiber is at least about 3:4 and the weight ratio of particulate mineral reinforcing agent to glass fiber is in the range of about 1:3 to about 9:1.
Inventors:
DONARUDO DEIBITSUTO DONAAMEIYA
JIYOSEFU GARUBUAMU MAACHINSU
JIYOSEFU GARUBUAMU MAACHINSU
Application Number:
JP12880279A
Publication Date:
April 11, 1980
Filing Date:
October 03, 1979
Export Citation:
Assignee:
MONSANTO CO
International Classes:
C08L77/00; C08L67/00; C09J5/06; C09J153/00; C09J167/00; C09J177/00; C09J177/12; (IPC1-7): C08K7/20; C08L67/02; C08L77/00; C09J3/16