Title:
HOT MELT ADHESIVE DISTRIBUTION SYSTEM
Document Type and Number:
Japanese Patent JP2020019654
Kind Code:
A
Abstract:
To provide a hot melt adhesive distribution system which stores and conveys a supply source of material.SOLUTION: A hot melt adhesive distribution system includes a bin for storing and conveying a supply source of material. The bin includes: a housing which defines an internal chamber configured to receive the material; at least one outlet configured to direct the material from the bin; a plate which defines a lower end of the internal chamber and is configured to support and direct the material to the at least one outlet; an agitation device attached to the plate; and a gasket arranged between the plate and the housing.SELECTED DRAWING: Figure 1A
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Inventors:
CHARLES P GANZER
ENES RAMOSEVAC
ENES RAMOSEVAC
Application Number:
JP2019140687A
Publication Date:
February 06, 2020
Filing Date:
July 31, 2019
Export Citation:
Assignee:
NORDSON CORP
International Classes:
B65G65/40; B65G65/42
Attorney, Agent or Firm:
Okabe
Takao Ochi
Seiichiro Takahashi
Takao Matsui
Kawauchi Eiji
Hideyuki Iwatsuki
Takao Ochi
Seiichiro Takahashi
Takao Matsui
Kawauchi Eiji
Hideyuki Iwatsuki