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Patent Searching and Data


Title:
HOUSING, MANUFACTURING METHOD OF HOUSING, ELECTRONIC DEVICE, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2011245689
Kind Code:
A
Abstract:

To solve the problems that there often occur shrinkage of a decoration sheet, exposure of a substrate caused by peeling etc., occurrence of creases at a rising portion etc., and a warping of the whole, which are caused when producing a housing by decorating the surfaces of the housing by pasting by means of vacuum molding or vacuum pressure molding the decorating sheet such as a skin type having a fiber layer on the surface of a coated molding made of a metal etc. which is a material of the housing used for an electronic device.

The problems can be dissolved by pasting by means of vacuum molding or vacuum pressure molding the decorating sheet formed with a shrinkage suppressing adhesive layer coated and impregnated with a thermoplastic adhesive based on a synthetic rubber containing glass minute particles on a surface region one side of the fiber layer wherein a foamable resin layer and a non-foamable resin layer are laminated in this order in the other surface side of the fiber layer.


Inventors:
ISHIZUKA KENSHIN
Application Number:
JP2010119629A
Publication Date:
December 08, 2011
Filing Date:
May 25, 2010
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
B32B5/18; C09J7/04; C09J11/04; C09J121/00
Domestic Patent References:
JP2007235825A2007-09-13
JPH02120879U1990-09-28
JPH0525779A1993-02-02
JP2004091796A2004-03-25
JP2004115705A2004-04-15
Foreign References:
WO2008053527A12008-05-08
Attorney, Agent or Firm:
Junichi Yokoyama