Title:
基材の回収方法
Document Type and Number:
Japanese Patent JP7447475
Kind Code:
B2
Abstract:
To provide a method which is excellent in peeling property between a cured film of a moisture-curable polyurethane hot-melt resin composition and a substrate and enables the substrate to be reworked.SOLUTION: A method for recovering a substrate is provided in which a laminate having the substrate and a cured film of a moisture-curable polyurethane hot-melt resin composition is heated and the substrate is recovered, wherein a gel fraction of the cured film of the moisture-curable polyurethane hot-melt resin composition is 80 mass% or more. The moisture-curable polyurethane hot-melt resin composition preferably contains an urethane prepolymer (i) having an isocyanate group containing specific polyol (A) and polyisocyanate (B) as raw materials.SELECTED DRAWING: None
Inventors:
Kimie Saito
Toyokuni Fujiwara
Toyokuni Fujiwara
Application Number:
JP2019230240A
Publication Date:
March 12, 2024
Filing Date:
December 20, 2019
Export Citation:
Assignee:
DIC Corporation
International Classes:
C09J5/06; B29B17/02; C08G18/10; C08G18/30; C08G18/40; C08G18/42; C08G18/44; C08G18/48; C08G18/62; C09J7/35; C09J175/06; C09J175/08
Domestic Patent References:
| JP2016113551A | ||||
| JP2016113552A | ||||
| JP2017119871A | ||||
| JP2019065299A | ||||
| JP2015163399A |
Foreign References:
| WO2019188571A1 | ||||
| US20180235316 |
Attorney, Agent or Firm:
Shinji Ogawa
Akihiro Iwamoto
Takayuki Ohno
Akihiro Iwamoto
Takayuki Ohno