Title:
電子回路組立装置、ラジアルリード部品装着方法
Document Type and Number:
Japanese Patent JP7058705
Kind Code:
B2
Abstract:
To improve an electronic circuit assembly device and a method of mounting a radial lead component.SOLUTION: In an electronic circuit assembly device, a radial lead component feeder supplies a radial lead component at a component supply position while holding a lead wire. The radial lead component thus supplied is gripped by a chuck of a work head so as to be mounted on a circuit board. In this way, the radial lead component can be stably gripped by the chuck because the lead wire is held at the component supply position. As a result, it becomes possible to satisfactorily mount the radial lead component onto the circuit board.SELECTED DRAWING: Figure 5
Inventors:
Shigeo Saito
Soga
Soga
Application Number:
JP2020195681A
Publication Date:
April 22, 2022
Filing Date:
November 26, 2020
Export Citation:
Assignee:
Fuji corporation
International Classes:
H05K13/04; H05K13/02
Domestic Patent References:
| JP7029900U | ||||
| JP4555126B2 | ||||
| JP2013162104A | ||||
| JP2013222771A | ||||
| JP2672342B2 |
Attorney, Agent or Firm:
Chubu International Patent Office