Title:
発光装置の作製方法
Document Type and Number:
Japanese Patent JP6602832
Kind Code:
B2
Abstract:
To provide a method for fabricating a light-emitting device using flexible glass which is capable of withstanding a process temperature higher than or equal to 500° C., and the light-emitting device. A second substrate is attached to a support substrate using an adsorption layer. The second substrate is bonded to a backplane substrate provided with a transistor and a light-emitting element. The backplane substrate includes a separation layer and a buffer layer. A first substrate is separated from the backplane substrate by separation between the separation layer and the buffer layer. A flexible third substrate is bonded, using a second adhesive layer, to a surface of the buffer layer exposed by the separation. The support substrate is separated from the second substrate by separation between the second substrate and the adsorption layer.
Inventors:
Yoshiharu Hiragata
Application Number:
JP2017225262A
Publication Date:
November 06, 2019
Filing Date:
November 23, 2017
Export Citation:
Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
H05B33/10; G09F9/30; H01L27/32; H01L51/50; H05B33/02; H05B33/04
Domestic Patent References:
| JP2005197673A | ||||
| JP2008097829A | ||||
| JP2010244698A | ||||
| JP2011181913A | ||||
| JP2011086122A | ||||
| JP2011075809A | ||||
| JP2011216210A | ||||
| JP2003229548A | ||||
| JP2004174664A |
Foreign References:
| WO2012020677A1 |