Title:
光学部品およびシリコーン組成物および光学部品の成型方法
Document Type and Number:
Japanese Patent JP2010508377
Kind Code:
A
Abstract:
Silicone compositions that cure to form cured silicone resins are used to prepare optical devices, such as optical waveguides, lightguides, and LED packages. The optical devices may be prepared by various processes, including an injection molding process.
Inventors:
Moneysh Bahadoo
Brian Robert Harkness
Afruse the lisphi
Anne Walstrom Norris
Brian Robert Harkness
Afruse the lisphi
Anne Walstrom Norris
Application Number:
JP2009526648A
Publication Date:
March 18, 2010
Filing Date:
August 23, 2007
Export Citation:
Assignee:
DOW CORNING CORPORATION
International Classes:
C08G77/50; C08J5/00; C08K5/05; C08K5/5415; C08L83/05; C08L83/07; G02B1/04; G02B6/00; G02B6/12
Domestic Patent References:
| JPH10120906A | 1998-05-12 | |||
| JP2004186168A | 2004-07-02 | |||
| JP2000235103A | 2000-08-29 | |||
| JP2004359756A | 2004-12-24 | |||
| JP2004066556A | 2004-03-04 | |||
| JP2006519896A | 2006-08-31 | |||
| JP2005105217A | 2005-04-21 | |||
| JP2005076003A | 2005-03-24 | |||
| JP2004143361A | 2004-05-20 | |||
| JP2009523856A | 2009-06-25 |
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro