PURPOSE: To enable the surface mounting to the top face of a mother board of a hybrid IC by composing an upper terminal of a fitting section divided into a lower terminal and a front end section led out in approximately parallel with a substrate and holding the substrate by the upper terminal and the lower terminal.

CONSTITUTION: A plurality of notch sections 13 are formed to the peripheral section of a substrate 11, and leads 14 are set up into the notch sections 13 respectively. The leads 14 are constituted of fitting sections 14b divided into upper terminals 15 and lower terminals 16 and front end sections 14a led out in approximately parallel with the substrate 11. The substrate 11 is held among the upper terminals 15 and the lower terminals 16, and the upper and lower terminals are connected positively to the substrate 11 through soldering, etc. The front end sections 14a of the leads 14 are arranged under the state, in which the front end sections 14a are positioned on the sides farther inner than the side faces 11a of the substrate 11, and prevent projection toward the outside from the side faces 11a. Accordingly, the application of external force is prevented to an hybrid IC, thus allowing surface mounting to a mother board.