Title:
HYBRID INTEGRATED CIRCUIT
Document Type and Number:
Japanese Patent JPS6154657
Kind Code:
A
Abstract:
PURPOSE: To form multilayer wirings on a thick-film resistor on a creamic substrate by using resin group insulating paste, which can be baked at a low temperature, and conductive paste.
CONSTITUTION: A conductor 1 and a thick-film resistor 5 are formed onto a ceramic substrate 1 through a conventional technique, and resin paste is printed and cured to shape an insulating layer 7. Epoxy group Ag paste is printed and cured to form a conductor 8, and lastely resin paste is printed and cured to shape a protective layer 9. According to the constitution, multilayer wirings can be formed without varying the resistance value of the thick-film resistor.
Inventors:
SAKATA HIROMI
Application Number:
JP17621384A
Publication Date:
March 18, 1986
Filing Date:
August 24, 1984
Export Citation:
Assignee:
NEC CORP
International Classes:
H01C7/00; H01L27/01; H05K1/16; H05K3/46; (IPC1-7): H01L27/01; H05K1/16
Attorney, Agent or Firm:
Uchihara Shin