PURPOSE: To obtain a semi-order-made hybrid memory module by forming a predetermined conductor pattern and a lead to a substrate, mounting a decoder element at a prescribed position and properly setting up a plurality of memory elements at other predetermined positions.

CONSTITUTION: Conductor patterns are formed on a substrate 6 consisting of ceramics, etc., and leads 7 for connecting an external circuit connected to the conductor patterns and the hybrid memory module are studded to the side surface of the substrate 6. A decoder element 5 is mounted previously at a predetermined position on the substrate 6, and the state in which RAMs 1∼4 can be set up at other prescribed positions is brought. Accordingly, when the word constitution of memory elements is equal and the functions of pins are similar in accordance with the reference of the JEDEC, the hybrid memory modules can be mounted on the same substrate or the same package even when electric specifications differ.