Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0778942
Kind Code:
A
Abstract:
PURPOSE: To provide a semiconductor device which can be subjected to a failure analysis even if a bonding pad is lost during the analysis.
CONSTITUTION: A pad 3 for bonding and a pad 4, which is electrically connected with the pad 3 and is coated with an insulating film 5, are formed. Thus, even when the pad 3 is lost, the pad 4 can be used for analyzing by peeling the insulating film 5.
Inventors:
HIRAYAMA NOBUKI
Application Number:
JP22157193A
Publication Date:
March 20, 1995
Filing Date:
September 07, 1993
Export Citation:
Assignee:
NEC CORP
International Classes:
H01L21/60; H01L21/66; H01L21/82; H01L21/822; H01L27/04; G01R31/28; (IPC1-7): H01L27/04; H01L21/822; G01R31/28; H01L21/60; H01L21/66; H01L21/82
Domestic Patent References:
| JPS60189248A | 1985-09-26 | |||
| JPH02159048A | 1990-06-19 |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)
Next Patent: カセツトロ−デイング装置