PURPOSE: To enhance dimensional accuracy and improve the reliability of the performance by installing an intermediate metal film state lower part of a resistor between top electrodes and forming a resistor or a glass film on the top of an insulation substrate and then installing dividing grooves in a specified size.
CONSTITUTION: Top electrode 2 and intermediate metal films 3 are formed simultaneously on the surface of a heat resistant insulation substrate 1. Resistors 4 are formed on a part of the top electrodes 2 and all of the intermediate metal films 3. Glass films are further formed to cover the resistors 4 completely. Dividing grooves 6 are make in the insulation substrate with a sharp cutting blade in order to divide discrete chip resistors. Then, the insulation substrate 1 is divided in the shape of strips to provide strip-shaped insulation substrates 7. End face electrodes 8 are formed on the side surfaces of the strip-shaped insulation substrates 7 so as to cover the top electrodes 2 partially. Then, the strip-shaped insulation substrates 7 which have formed the end face electrodes 8 are divided into discrete piece-shaped insulation substrates 9. Finally, a plating film 10 based on electrolytic plating is formed on the exposed top electrodes 2 and the end face electrodes 8.
ITAGAKI MINEHIRO
YUHAKU SEI
HAKOTANI YASUHIKO
BESSHO YOSHIHIRO
ISOZAKI YASUTO
SUYAMA AYUMI
