Title:
【発明の名称】リードフレーム、半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP3001483
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent position deviation of a semiconductor element bonded on a die pad, by providing the structure wherein a shape-memory alloy, which becomes the protruding shape to the specified height by specified temperature, is provided on the die pad of a lead frame. SOLUTION: In the manufacturing method of a shape-memory alloy 4, after the shape-memory alloy 4 is inputted between irregular dies and formed in the L shape, the shape-memory alloy 4 is flattened by a flat mold at room temperature. Then, at first, a lead frame is placed on a fixing jig 5. Thereafter, bonding agent 6 is applied on a die pad 2, to which the shape-memory alloy 4 is welded. Then, a semiconductor element 7 is mounted on the applied bonding agent 6 and bonded. The semiconductor element 7 on the soft bonding agent 6 receives the accuracy and the vibration of the device in mounting and generates position deviation. Then, the shape-memory alloy 4 is recovered in the vicinity of 85 deg.C at the time of heating by the hardening of the bonding agent and becomes L shape. The semiconductor element 7 generating the position deviation is fixed, and the position deviation is eliminated. Thus, the bonding agent 6 is completely hardened.
Inventors:
Tadayuki Shintani
Application Number:
JP31111497A
Publication Date:
January 24, 2000
Filing Date:
October 28, 1997
Export Citation:
Assignee:
Kyushu NEC Corporation
International Classes:
H01L21/60; H01L23/50; (IPC1-7): H01L23/50; H01L21/60
Domestic Patent References:
| JP60195943A | ||||
| JP6083242U |
Attorney, Agent or Firm:
Shiroyuki Hori