Title:
【発明の名称】半導体装置の製造方法と荷電粒子ビーム用透過マスク
Document Type and Number:
Japanese Patent JP2677292
Kind Code:
B2
Inventors:
Toyotaka Kataoka
Juichi Sakamoto
Juichi Sakamoto
Application Number:
JP26752288A
Publication Date:
November 17, 1997
Filing Date:
October 24, 1988
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L21/027; H01L21/30; (IPC1-7): H01L21/027
Domestic Patent References:
| JP62260322A | ||||
| JP59169131A | ||||
| JP52119185A | ||||
| JP53143175A |
Attorney, Agent or Firm:
Keishiro Takahashi