Title:
【発明の名称】半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP3142723
Kind Code:
B2
Abstract:
A semiconductor device comprising a semiconductor chip, a plurality of electrode pads formed on the semiconductor chip, a metal wiring having a desired pattern and connected to the electrode pads, an anisotropic conductive film containing fine conductive particles and laminated on the semiconductor chip including the metal wiring, and an external electrode, in which the anisotropic conductive film has a concave portion at a desired portion on the metal wiring and the metal wiring is connected to the external electrode through the intermediary of the fine conductive particles present in the anisotropic conductive film by stuffing and sticking the external electrode in the concave portion.
Inventors:
Katsunobu Mori
Application Number:
JP22680794A
Publication Date:
March 07, 2001
Filing Date:
September 21, 1994
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01L21/3205; H01L21/60; H01L23/52; H01L21/822; H01L23/12; H01L23/31; H01L23/528; H01L23/532; H01L27/04; (IPC1-7): H01L21/60; H01L23/12
Domestic Patent References:
| JP9115913A |
Attorney, Agent or Firm:
Shintaro Nogawa