Title:
【発明の名称】面実装型半導体パッケージの包装体
Document Type and Number:
Japanese Patent JP2781522
Kind Code:
B2
Inventors:
Kitamura Peace
Murakami
Kunihiko Nishi
Murakami
Kunihiko Nishi
Application Number:
JP18808894A
Publication Date:
July 30, 1998
Filing Date:
August 10, 1994
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
B65D30/08; B65D81/26; B65D85/86; (IPC1-7): B65D81/26
Domestic Patent References:
| JP6235840A | ||||
| JP63303726A | ||||
| JP6021480U |
Attorney, Agent or Firm:
Yamato Tsutsui