Title:
【発明の名称】バンプ用微小金ボール
Document Type and Number:
Japanese Patent JP3086126
Kind Code:
B2
Abstract:
PURPOSE:To provide microscopic bump gold balls having high degree of strength and excellent bondability and having no anisotropy in deformation by a method wherein a very small quantity of an alloy compound is added to high purity gold. CONSTITUTION:This microscopic gold ball contains Pd of 0.003 to 0.02wt.%, and one or more elements selected from Cu and Ag are contained if necessary. The quantity of Cu is 0.0005 to 0.02wt.%, and the quantity of Ag is 0.005 to 0.005wt.%. Their total quantity is 0.001 to 0.02wt.%, and the remaining part is composed of Au and inevitable impurities.
Inventors:
Toshinori Ando
Kohei Tatsumi
Osamu Kitamura
Masafumi Imada
Kohei Tatsumi
Osamu Kitamura
Masafumi Imada
Application Number:
JP7109994A
Publication Date:
September 11, 2000
Filing Date:
April 08, 1994
Export Citation:
Assignee:
Nippon Steel Corporation
International Classes:
H01L21/60; H01L21/321; (IPC1-7): H01L21/60
Domestic Patent References:
| JP2253627A | ||||
| JP2170931A | ||||
| JP291944A |
Attorney, Agent or Firm:
Hiroaki Tamura (1 outside)