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Patent Searching and Data


Title:
CLAD MATERIAL
Document Type and Number:
Japanese Patent JPH0774286
Kind Code:
A
Abstract:

PURPOSE: To provide a clad material for widening the use as a high thermal conductivity clad material by combining a high thermal conductivity metallic material, e.g. copper or copper alloy, with a low thermal expansion alloy metal which can sustain the thermal expansion characteristics of superinvar alloy at 150°C or below up to about 300°C.

CONSTITUTION: An Fe-Ni-Co alloy containing 31.5-33.5wt.% of Ni, 7-8wt.% of Co, and 40.5wt.% or less of (Ni+Co) can sustain the thermal expansion characteristics at 150°C or below up to about 300°C. When a high thermal conductivity metallic material, e.g. copper, is clad with such alloy the ratio of copper can be increased up to 30-70%. Consequently, a novel clad material having average coefficient of thermal expansion in the longitudinal direction lower than 8×10-6K-1 in the temperature ranges of 30-100°C and 30-350°C and thermal conductivity in the longitudinal direction lower than 100W.m-1.K-1 can be obtained.


Inventors:
HIRANO KENJI
Application Number:
JP24073293A
Publication Date:
March 17, 1995
Filing Date:
August 31, 1993
Export Citation:
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Assignee:
SUMITOMO SPEC METALS
International Classes:
C22C38/00; H01L23/06; H01L23/14; H01L23/373; (IPC1-7): H01L23/14; C22C38/00; H01L23/06; H01L23/373
Attorney, Agent or Firm:
Yoshihisa Oshida