Title:
【発明の名称】或るパラメータを持つ冷却装置及び脱毛装置を有する脱毛システム
Document Type and Number:
Japanese Patent JP2003501191
Kind Code:
A
Abstract:
A depilation system which comprises a depilation device and a cooling device and in which the cooling device comprises a housing in which a certain quantity of cooling agent is contained, and in which the cooling device is provided with a skin contact portion having a certain skin contact surface area, and in which the cooling device has a certain power for cooling skin regions through the skin contact portion (13), and in which the value of the power of the cooling device (3) is at least 3 W, the value of the quantity of cooling agent contained is at least 20 ml, and the value of the contact surface area of the skin contact portion (13) is at least 3 cm2.
Inventors:
Wolfgang Obermann
Hans Fruth Scholzer
Roland waltner
Hans Fruth Scholzer
Roland waltner
Application Number:
JP2001502717A
Publication Date:
January 14, 2003
Filing Date:
June 07, 2000
Export Citation:
Assignee:
Konin Krekka Philips Electronics NV
International Classes:
A45D26/00; (IPC1-7): A45D26/00
Domestic Patent References:
| JPH08503158A | 1996-04-09 |
Foreign References:
| EP0348862A2 | 1990-01-03 |
Attorney, Agent or Firm:
Sugimura Kosaku (1 person outside)