Title:
【発明の名称】包装材を打ち抜くための方法および装置
Document Type and Number:
Japanese Patent JP2795417
Kind Code:
B2
Abstract:
PCT No. PCT/SE90/00040 Sec. 371 Date Jul. 5, 1991 Sec. 102(e) Date Jul. 5, 1991 PCT Filed Jan. 17, 1990 PCT Pub. No. WO90/08018 PCT Pub. Date Jul. 26, 1990.A process and an apparatus for preventing a packaging material which is being die-cut and scored from developing cracks. A crack-reducing sheet material (17) is positioned between the cutting/scoring tools (9, 13) and the packaging material (5) to absorb impact energy from said tools and relieve the packaging material of crackproducing forces in the direction of its plane.
Inventors:
KAURIN SHEEREN
EDOHORUMU BIRUGAA
EDOHORUMU BIRUGAA
Application Number:
JP50240790A
Publication Date:
September 10, 1998
Filing Date:
January 17, 1990
Export Citation:
Assignee:
KAURIN SHEEREN
EDOHORUMU BIRUGAA
EDOHORUMU BIRUGAA
International Classes:
B26D1/06; B26D3/08; B26D7/00; B26D7/08; B26F1/00; B26D7/20; B31B1/14; B31B50/20; B31B50/22; B31B50/25; (IPC1-7): B31B1/20; B26D1/06; B26D7/00; B31B1/25
Domestic Patent References:
| JP53146391A | ||||
| JP6222820U |
Attorney, Agent or Firm:
Chika Takagi (2 outside)