Title:
【発明の名称】溶融温度の相対的に低い底層にセラミックの層を取り付ける方法
Document Type and Number:
Japanese Patent JP2001523182
Kind Code:
A
Abstract:
In a method of applying a ceramic layer to an under-layer having a relatively low melting temperature, in particular a synthetic resin under-layer, particles of a ceramic material are provided on such an under-layer and, by heating, a mechanical bond between ceramic particles and the under-layer is brought about. By means of a laser device, a temperature is generated, for a time of the order of or shorter than the melting time of the under-layer, which is at least effective to obtain mutual compacting and/or sintering of the ceramic particles.
Inventors:
Wadman Shipke
Application Number:
JP54444499A
Publication Date:
November 20, 2001
Filing Date:
February 22, 1999
Export Citation:
Assignee:
Konin Krekka Philips Electronics NV
International Classes:
B32B18/00; B32B37/00; C04B35/622; C04B35/64; (IPC1-7): B32B18/00; B32B31/00
Attorney, Agent or Firm:
Akihide Sugimura (2 outside)