Title:
【発明の名称】活性剤溶液を含有し、化学機械的に磨くためのスラリーシステム
Document Type and Number:
Japanese Patent JP2002528903
Kind Code:
A
Abstract:
This invention relates to a CMP slurry system for use in semiconductor manufacturing. The slurry system comprises two parts. The first part is a generic dispersion that only contains an abrasive and, optionally, a surfactant and a stabilizing agent. The generic dispersion can be used for polishing metals as well as interlayer dielectrics (ILD). The second part is a novel activator solution comprising at least two components selected from the group consisting of: an oxidizer, acids, amines, chelating agents, fluorine-containing compounds, corrosion inhibitors, buffering agents, surfactants, biological agents and mixtures thereof.
Inventors:
Deepak Mahfuulikar
Application Number:
JP2000578398A
Publication Date:
September 03, 2002
Filing Date:
October 22, 1999
Export Citation:
Assignee:
OLIN MICROELECTRONIC CHEMICALS,INC.
International Classes:
B24B37/00; A01N33/06; A01N43/40; A01N59/08; C09G1/02; C09K3/14; C09K13/02; C09K13/04; C09K13/06; C09K13/08; H01L21/304; H01L21/306; (IPC1-7): H01L21/304; A01N33/06; A01N43/40; A01N59/08; B24B37/00; C09K3/14; C09K13/02; C09K13/04; C09K13/06; C09K13/08; H01L21/306
Domestic Patent References:
| JPH1067986A | 1998-03-10 | |||
| JPH03202269A | 1991-09-04 | |||
| JPH0883780A | 1996-03-26 | |||
| JPH10163140A | 1998-06-19 | |||
| JPH09285968A | 1997-11-04 | |||
| JPH10166258A | 1998-06-23 |
Attorney, Agent or Firm:
Chika Takagi (2 outside)