To provide an IC card which is inexpensive and high in reliability and excellently suppresses an external force, specially, to an IC chip and a method for manufacturing the IC card with good economy.

This IC card consists of a card module 3 composed an antenna circuit 2 composed of a winding coil and a module substrate 1 mounted with a semiconductor chip 13, a hot-melt adhesive layer 4 covering the card module 3, and surface layer materials 5 provided on both its surfaces. On the module substrate 1, a circuit conductor 11 for a connection with the semiconductor chip 13 and a land part 25 for a connection with the antenna circuit 2 are formed.