To prevent torsion as little as possible by arranging or blending reinforcement material whose linear expansion coefficient to low into/with sealing resin.

The IC module 10 is constituted by fitting an IC chip 12 and capacitors 13, 14 to a substrate 11 consisting of glass cloth base material and epoxy resin and forming an antenna coil 15 by photolithography. In this case, glass cloth used as a first reinforcing fiber 3 is buried into sealing resin 32 in a state in which glass cloth is laminated in the rear side of the substrate 11. Further, glass cloth used as a second reinforcing fiber 4 is bored to pass the projecting parts of the IC chip 12 and capacitors 13, 14 which are projected from the substrate 11. The glass cloth for the second reinforcing fiber 4 is buried into sealing resin 32 in a state in which glass cloth is laminated on the surface side of the substrate 11. Therefore, the linear expansion coefficient of sealing resin 32 is lowered. Difference of linear expansion coefficients of the IC module 10 and sealing resin 32 burying the IC module is made little. Torsion caused by the difference of the linear expansion coefficients is made difficult to be generated.