Title:
IC OPERATION INDICATING MODULE
Document Type and Number:
Japanese Patent JPH02101778
Kind Code:
A
Abstract:
PURPOSE:To easily recognize the operation of an IC by electrically connecting the lead pin of a surface mounting IC and one end of an LED via a conductor circuit of a wiring board, and electrically connecting the other end of the LED and an external connection lead of the wiring board via the conductor circuit of the wiring board. CONSTITUTION:A pad 11 connected with an IC 10 is connected with a buffer IC 51 arranged on the rear of a printed wiring board 3, via a conductor circuit 31 and a through hole 35 arranged on the printed wiring board 3. The buffer IC 51 is connected with a pad 21 connected with one end of an LED 2, via a through hole 36 and a conductor circuit 32. A pad 22 connected with the other end of the LED 2 is electrically connected with a wiring board pin 4 in the grounded state, by a conductor circuit 33. When the surface mounting IC is operated, a current flows through one or several lead pins among a lot of lead pins of the surface mounting IC 10 on the module. At that time, the LED 2 connected with the above lead pin emits light, thereby recognizing the operation state of the surface mounting IC.
Inventors:
TAKAHASHI MASAHARU
HIRATA YUTAKA
HIRATA YUTAKA
Application Number:
JP25447988A
Publication Date:
April 13, 1990
Filing Date:
October 07, 1988
Export Citation:
Assignee:
IBIDEN CO LTD
HIRATA GIJUTSU KENKYUSHO KK
HIRATA GIJUTSU KENKYUSHO KK
International Classes:
G09F9/00; H01L33/12; H01L33/48; H05K1/18; H05K1/02; (IPC1-7): G09F9/00; H01L33/00; H05K1/18
Attorney, Agent or Firm:
Yoshiyasu Takahashi