Title:
IC PACKAGE SUBSTRATE HAVING OVERVOLTAGE PROTECTIVE FUNCTION
Document Type and Number:
Japanese Patent JP2003158237
Kind Code:
A
Abstract:
To provide an IC package substrate having an overvoltage protective function.
This IC package substrate is provided with a lower electrode (25) arranged on the substrate, a protective material layer (24) arranged on the electrode (25) and electrically connected to the electrode (25), and an upper electrode (21) arranged on the layer (24). This substrate is also provided with a grounding conductor (23).
Inventors:
LEE CHUN-YUAN
Application Number:
JP2002241744A
Publication Date:
May 30, 2003
Filing Date:
August 22, 2002
Export Citation:
Assignee:
INPAQ TECHNOLOGY CO LTD
International Classes:
H01L23/62; H01L23/12; (IPC1-7): H01L23/62; H01L23/12
Attorney, Agent or Firm:
Takashi Ishida (4 others)
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