To provide an IC socket of which the contact can contact by metal to a land on the IC package side, and which can cope with multiple pins, fine pitch, large current, and high speed with high productivity.
One end part side of a contact piece 10 is formed integrally at a contact fixing part 22 of a socket base body 20 and the portion other than one end part faces a through hole 21. The through hole part 30 is made of a plating layer 32 which is formed at the surrounding of the aperture part 11 of the contact piece 10 and the surrounding of the rear face side of the through hole 31 with the aperture part 11 of the contact piece 10 and the through hole 31 in a coincided state, through the inner wall of the through hole 31 penetrating the contact fixing part 22 in front and rear direction.
MIYAZAWA HARUO
YAMAGAMI KATSUYA
| JP2004095326A | 2004-03-25 | |||
| JP2000091048A | 2000-03-31 | |||
| JPH1012761A | 1998-01-16 | |||
| JPH10208835A | 1998-08-07 | |||
| JPS5519536A | 1980-02-12 |
Iwa Saki Kokuni
Kawamata Sumio
Shunichi Takahashi