To provide an IC tag articulated object for preventing the damage of an IC chip from being generated in a manufacturing process without generating winding collapse even when this IC tag connection object is shaped like winding.
The IC tag articulated object is configured by holding an IC tag articulated object 1A1 by adhesive 8 on a band-shaped peeling paper 9 surface, and arraying non-contact IC tags removed like a label shape in a row. The non-contact IC tag of each unit is characterized so that an IC chip 3 is mounted on an antenna pattern 2 formed on an inlet base material 11, and that a sheet-shaped buffering material 6 in which the peripheral section of the IC chip 3 is opened 61 is laminated on the whole surface between the antenna pattern 2 surface and a surface protection sheet 4 in such configurations that the IC chip 3 and the antenna pattern 2 surface are coated with the surface protection sheet 4. The IC tag articulated object includes various execution configurations that the non-contact IC tag is not removed like a label, or that a plate-shaped buffering member 7 is arranged before and after the IC chip 3 or the like.
Keiko Fukamachi
Hideo Ito
Hiromi Fujimasu
Naoki Goto
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