Title:
IC TAG AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP2001256456
Kind Code:
A
Abstract:
To provide an IC tag which is formed very thinly and in a small size and easy to be used and to also manufacture a large amount of IC tags at low cost.
A semiconductor element 14 whose thickness is almost the same as the thickness of a planar coil 20 is mounted at a void area of the center of the coil 20 obtained by winding the wires 18 in adjacent relation in a planar shape, and the element 14 is electrically connected to the coil 20. The element 14 is supported by a supporting film 22 pasted on one surface of the coil 20.
Inventors:
HIGUCHI TSUTOMU
Application Number:
JP2000066359A
Publication Date:
September 21, 2001
Filing Date:
March 10, 2000
Export Citation:
Assignee:
SHINKO ELECTRIC IND CO
International Classes:
B42D25/40; B42D25/305; G06K19/07; G06K19/077; (IPC1-7): G06K19/07; B42D15/10; G06K19/077
Attorney, Agent or Firm:
Takao Watanuki (1 outside)