Title:
電子部品実装装置および電子部品実装装置における画像読取り方法
Document Type and Number:
Japanese Patent JP5051082
Kind Code:
B2
Inventors:
Takayuki Hatase
Takuya Tsutsumi
Takuya Tsutsumi
Application Number:
JP2008247831A
Publication Date:
October 17, 2012
Filing Date:
September 26, 2008
Export Citation:
Assignee:
Panasonic Corporation
International Classes:
H05K13/04; G01B11/00; H05K13/08
Domestic Patent References:
| JP2008091725A | ||||
| JP2005277132A | ||||
| JP2006019554A | ||||
| JP2001021318A | ||||
| JP9214195A |
Attorney, Agent or Firm:
Hiroki Naito
Daisuke Nagano
Kentaro Fujii
Daisuke Nagano
Kentaro Fujii