Title:
IMAGE SENSOR ASSEMBLY AND ITS MANUFACTURE METHOD
Document Type and Number:
Japanese Patent JP2006135318
Kind Code:
A
Abstract:
To provide an image sensor assembly and its manufacture method capable of minimizing contamination in a packaging process.
An image sensor assembly 300 comprises an image sensor 310 having a light receiving circuit 312 exposed to the surface thereof, and a support material 325 that protrudes from the surface so as to define a region determined in advance on the surface. Further, the assembly includes a transparent cover 320 that is attached to the surface of the image sensor 310 so as to enclose the light receiving circuit 312 with the support material 325, and the light receiving circuit 312 is covered with the transparent cover 320.
Inventors:
CHOI YONG-HWAN
YOON YOUNG-KWON
MUN GI-TAE
YOON YOUNG-KWON
MUN GI-TAE
Application Number:
JP2005308795A
Publication Date:
May 25, 2006
Filing Date:
October 24, 2005
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD
International Classes:
H01L23/02; H01L27/14; H01L27/146; H01L27/148; H04N5/335; H04N5/374
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro