PURPOSE: To prevent infiltration of moisture and deliquescence of an optical filter by a method wherein the optical filter is arranged on a solid image sensor to correct visual sensitivity intercepting infrared rays and the solid image sensor and the optical filter are sealed with a transparent molding resin.

CONSTITUTION: A ceramic chip carrier 6 is connected electrically onto a flexible substrate 5 by soldering. The solid image sensor 8 is diebonded on the chip carrier 6 and is connected to the chip carrier 6 electrically by a bonding wire 9. An optical filter 11 for correcting visual sensitivity is bonded on an optically effective pixel area of the solid image sensor 8 with a transparent adhesive of an ultraviolet hardening type or the like and sealed with a transparent molding resin 14. This enables the complete elimination of infiltration of moisture into the optical filter 11.