IMPREGNATION DIE FOR LIQUID THERMOSETTING RESIN COMPOUND

Title:

IMPREGNATION DIE FOR LIQUID THERMOSETTING RESIN COMPOUND

Document Type and Number:

Japanese Patent JPS555839

Kind Code:

A

Abstract:

PURPOSE: To obtain high quality moldings including no voids by impregnating resin into and exhausting the air out of the cavity which is disposed inclined in the impregnation die with respect to the vertical line of the die.

CONSTITUTION: A cavity 22 is provided in the impregnation die 21 with its central line or surface inclined at a predetermined angle θ with respect to the vertical line of the die. A liquid thermosetting resin composition 23 is poured into the cavity 22 through a resin inlet 24 by means of a pouring apparatus 25. The air within the cavity is exhausted therefrom. After pouring is completed, the resin is subject to the heating prosses to set.

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Inventors:

KOJIMA SUSUMU
MOTOKI MITSUO
MOURI YUTAKA

Application Number:

JP7875778A

Publication Date:

January 17, 1980

Filing Date:

June 30, 1978

Export Citation:

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Assignee:

TOKYO SHIBAURA ELECTRIC CO

International Classes:

B29B7/00; B29C39/00; B29C39/24; B29C39/26; (IPC1-7): B29B5/00

Next Patent: JPS555840