Title:
インジウム−スズ−銀ベースの無鉛はんだ
Document Type and Number:
Japanese Patent JP6826995
Kind Code:
B2
Abstract:
Indium-tin-silver alloys suitable for use as a lead free solder are described herein. The alloys may comprise primarily indium or comprise primarily tin. The alloys may further include copper, nickel, and iron or copper, antimony, and zinc. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component. Methods of forming the alloys are also described herein.
Inventors:
John Pereira
Stephen Sea, Antaya
Stephen Sea, Antaya
Application Number:
JP2017557925A
Publication Date:
February 10, 2021
Filing Date:
May 12, 2016
Export Citation:
Assignee:
Adaptive Technologies Limited
International Classes:
B23K35/26; C22C13/00; C22C28/00; C22C38/00
Domestic Patent References:
| JP2014509944A | ||||
| JP2014515872A | ||||
| JP2000141078A | ||||
| JP61014096A | ||||
| JP6015476A | ||||
| JP2016165751A |
Foreign References:
| WO2011145591A1 | ||||
| WO2003021664A1 |
Attorney, Agent or Firm:
Shinjiro Ono
Osamu Yamamoto
Toru Miyamae
Motoharu Nakanishi
Toyoji Matsuda
Osamu Yamamoto
Toru Miyamae
Motoharu Nakanishi
Toyoji Matsuda