Title:
INDUCTANCE DEVICE AND ITS MANUFACTURING DEVICE
Document Type and Number:
Japanese Patent JP2001307928
Kind Code:
A
Abstract:
To provide an inductance device which is equipped with outer electrodes protruding less outward from the edge faces of a chip, and high in both inductance and a Q value and its manufacturing method.
Conductive paste of baking type is applied onto both the side faces of a rectangular board and dried out into outer electrode conductive paste films (unbaked) in a process S4. Then, the rectangular board is secondarily divided into chips of prescribed size in a process S5, and the outer electrode conductive paste films are baked at a high temperature in a process S6. Next, a plating film is formed through a wet electrolytic plating method or the like in a process S7.
Inventors:
AOKI KENICHI
AMAYA KEISHIRO
MIURA TAKEHIKO
AMAYA KEISHIRO
MIURA TAKEHIKO
Application Number:
JP2000123854A
Publication Date:
November 02, 2001
Filing Date:
April 25, 2000
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H01F41/04; H01F17/00; H01F27/29; (IPC1-7): H01F27/29; H01F17/00; H01F41/04
Domestic Patent References:
| JPH07106134A | 1995-04-21 | |||
| JPS56164514A | 1981-12-17 |
Attorney, Agent or Firm:
Morishita Takeichi