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Title:
INITIAL CHIPPING PREVENTIVE CUTTING METHOD OF SAW BLADE
Document Type and Number:
Japanese Patent JP3396276
Kind Code:
B2
Abstract:

PURPOSE: To prevent initial chipping by performing flattening cutting for a workpiece in which hard particles are dispersed in a soft material in advance.
CONSTITUTION: When a workpiece is cut and a band saw blade B is new, flattening cutting is done for the new band saw blade B. At this time, the band saw blade B which is run and rotated is lowered and positioned at a desired position below a work table 5. In this condition, a workpiece WA for flattening cutting in which hard particles are dispersed in a soft material is put on a work table 49 for flattening cutting and clamped by a clamp device. A motor 51 for pushing is driven to raise the work table 49 for flattening cutting and is pushed against the new band saw blade B which runs and rotates so that flattening cutting is done.


Inventors:
Mitsuo Kobayashi
Katsuhiro Horiguchi
Katsuhiko Oshibe
Application Number:
JP26661993A
Publication Date:
April 14, 2003
Filing Date:
October 25, 1993
Export Citation:
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Assignee:
Amada Co., Ltd.
International Classes:
B23D55/00; B23D47/00; B27B13/00; (IPC1-7): B23D55/00; B23D47/00; B27B13/00
Domestic Patent References:
JP3208518A
JP6034247A
JP61244407A
Attorney, Agent or Firm:
Hidekazu Miyoshi (7 outside)