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Patent Searching and Data


Title:
INJECTION MOLDED PRINTED WIRINGS AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH02310987
Kind Code:
A
Abstract:

PURPOSE: To conveniently, economically manufacture injection molded printed wirings secured integrally with aramid sheet by integrating the sheet printed with a conductor pattern on a synthetic resin molded form by injection molding.

CONSTITUTION: Aramid sheet is a conductor pattern carrying base material having excellent heat resistance, dimensional stability and air permeability due to characteristics of high heat resistance, high strength, etc., of aramid fiber. The sheet is coated to be printed on its one side surface with epoxy ink, immersed therewith, the ink is then cured, and a conductive pattern is screen printed thereon by utilizing mixture of silver powder and acrylic paint to be mixed at 7:3 by weight as conductive ink. The sheet formed with the pattern is so mounted in a mold cavity that the sheet formed with the pattern is brought into contact with the resin on the opposite side surface to the printed surface, the mold is then set, polyetherimide resin is injection molded with a picture at 390°C of resin temperature and 100°C of mold surface temperature, thereby raising the conductivity of the pattern by tens times.


Inventors:
YASUIKE AKIO
Application Number:
JP13025989A
Publication Date:
December 26, 1990
Filing Date:
May 25, 1989
Export Citation:
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Assignee:
ADO UNION KENKYUSHO KK
International Classes:
H05K1/03; H05K3/00; H05K3/20; (IPC1-7): H05K1/03; H05K3/00; H05K3/20
Attorney, Agent or Firm:
Nozaki